Versal Processors
Flexible compute with energy efficient AI Engines
Filtering, prioritizing, and compressing data makes better use of limited bandwidth by sending data products instead of raw data.
Efficiency
Data products can be small enough to transmit through satellite-to-satellite networks in seconds, avoiding the hours needed for traditional ground station passes.
Speed
On-board processing allows satellites to make quick decisions, eliminating the need to wait for commands from the ground. This means they can react immediately to changing situations.
Autonomy
Explore the Wasp Platform
The Wasp data processor, built on AMD’s Xilinx VersalEdge, combines FPGA, AI Engines, DSP, and CPU resources in a compact design. This system features a high-speed internal Network on Chip for efficient data processing. With extensive I/O capabilities, it is ideal for payload controller applications.
Colossus includes protection and telemetry circuits for monitoring, along with fault detection and isolation. Each subsystem is safeguarded with a resettable e-fuse to reduce radiation effects, and data is secured with Error Correction Codes (ECC) for RAM and all cache levels. Its modular design allows for easy customization.
Wasp Tech Specs
Processing Capabilities
AI Performance: 101 TOPS
CPU: Dual-core 72
AI Engines: 152 ML-optimized
DSP Engines: 984
FPGA: Up to 375k LUTs
OS: Linux-based (built w/Yocto)
Size, Weight, Power
Size: 1/3 U (96 x 89 x 30 mm), Fits CubeSats and SmallSats
Mass: <500 g
Power:
Idle: <1 W
Active: 20 W
Absolute Max: 35 W
Input Voltage: : 12 VDC, with internal eFuse for protection and monitoring
Telemetry: Internal ADC for voltage temperature telemetry
Memory & Storage
RAM: 16 GB LPDDR4 with ECC
Storage: 64 GB eMMC
Connectivity
Ethernet: Two 1000BASE-T
UART: Four RS-422, RS-485 compatible
PPS: RS-422 hardware
Expanded Interface Capabilities: Additional Gigabit Ethernet, SpaceWire, LVDS, Camera Link, PCIe, SpaceFibre, 40G Ethernet
Environmental
Radiation:
LEO missions NET Q1 2025
GEO/lunar version NET 2026
Temperature: -40 to +60 C Operating, -55 to +85 C Storage
Testing: Thermal, Vibration, and EMI/EMC compliant to GSFC-STD-7000